Kulicke And Soffa Industries | KLIC

Stock Price
38.21
Daily Change
0.43 1.14%
Monthly
19.00%
Yearly
-0.93%
Q3 Forecast
37.98

Peers Price Chg Day Year Date
Axcelis Technologies 80.61 1.82 2.31% -16.88% Sep/05
Advanced Energy Industries 153.74 3.60 2.40% 63.94% Sep/05
Applied Materials 162.75 4.51 2.85% -6.73% Sep/05
Amkor Technology 24.64 0.35 1.44% -13.57% Sep/05
Azenta 30.30 0.78 2.64% -36.62% Sep/05
Cohu 20.34 0.34 1.70% -15.88% Sep/05
Daqo New Energy 29.21 2.25 8.35% 92.30% Sep/05
Enphase Energy 39.65 3.13 8.57% -63.53% Sep/05
Entegris 81.98 2.33 2.93% -23.46% Sep/05
FormFactor 29.36 0.41 1.42% -29.89% Sep/05
Kulicke And Soffa Industries 38.21 0.43 1.14% -0.93% Sep/05
Lam Research 102.95 2.53 2.52% 40.41% Sep/05
MKS Instruments 104.49 2.77 2.72% 0.06% Sep/05
Marvell Technology 63.33 -0.77 -1.20% -4.31% Sep/05
Onto Innovation 104.07 2.12 2.08% -41.30% Sep/05
PDF Solutions 19.95 0.26 1.32% -30.12% Sep/05
Photronics 22.64 0.42 1.89% 2.91% Sep/05
Ultra Clean 24.38 0.49 2.05% -25.99% Sep/05
Veeco Instruments 24.51 0.63 2.64% -17.39% Sep/05

Indexes Price Day Year Date
USND 21700 -7.31 -0.03% 30.01% Sep/05

Kulicke And Soffa Industries traded at $38.21 this Friday September 5th, increasing $0.43 or 1.14 percent since the previous trading session. Looking back, over the last four weeks, Kulicke And Soffa Industries gained 19.00 percent. Over the last 12 months, its price fell by 0.93 percent. Looking ahead, we forecast Kulicke And Soffa Industries to be priced at 37.98 by the end of this quarter and at 37.30 in one year, according to Trading Economics global macro models projections and analysts expectations.

Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (ICs), high and low powered discrete devices, light-emitting diodes (LEDs) and power modules. The Company also services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. It operates through two segments: Capital Equipment and Aftermarket Products and Services (APS). The Capital Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The APS segment manufactures and sells expendable tools for a range of semiconductor packaging applications. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers.