Amkor Technology | AMKR

Stock Price
24.64
Daily Change
0.35 1.44%
Monthly
10.94%
Yearly
-13.57%
Q3 Forecast
24.44

Peers Price Chg Day Year Date
Taiwan Semiconductor 1,180.00 20.00 1.72% 28.54% Sep/05
Axcelis Technologies 80.61 1.82 2.31% -16.88% Sep/05
Advanced Energy Industries 153.74 3.60 2.40% 63.94% Sep/05
Applied Materials 162.75 4.51 2.85% -6.73% Sep/05
Amkor Technology 24.64 0.35 1.44% -13.57% Sep/05
Advanced Semiconductor Engineering 10.47 0.16 1.55% 17.11% Sep/05
Azenta 30.30 0.78 2.64% -36.62% Sep/05
Cohu 20.34 0.34 1.70% -15.88% Sep/05
Daqo New Energy 29.21 2.25 8.35% 92.30% Sep/05
Enphase Energy 39.65 3.13 8.57% -63.53% Sep/05
Entegris 81.98 2.33 2.93% -23.46% Sep/05
FormFactor 29.36 0.41 1.42% -29.89% Sep/05
Intel 24.49 -0.12 -0.49% 29.71% Sep/05
KLA-Tencor 905.09 31.80 3.64% 28.78% Sep/05
Kulicke And Soffa Industries 38.21 0.43 1.14% -0.93% Sep/05
Lam Research 102.95 2.53 2.52% 40.41% Sep/05
MKS Instruments 104.49 2.77 2.72% 0.06% Sep/05
Onto Innovation 104.07 2.12 2.08% -41.30% Sep/05
Universal Display 145.39 0.71 0.49% -21.25% Sep/05
PDF Solutions 19.95 0.26 1.32% -30.12% Sep/05
Photronics 22.64 0.42 1.89% 2.91% Sep/05
Rambus 74.81 -0.59 -0.78% 97.60% Sep/05
Taiwan Semiconductor Mfg 243.44 8.34 3.55% 54.84% Sep/05
Texas Instruments 187.93 0.64 0.34% -4.79% Sep/05
Ultra Clean 24.38 0.49 2.05% -25.99% Sep/05
Veeco Instruments 24.51 0.63 2.64% -17.39% Sep/05

Indexes Price Day Year Date
USND 21700 -7.31 -0.03% 30.01% Sep/05
US2000 2391 11.44 0.48% 14.33% Sep/05

Amkor Technology traded at $24.64 this Friday September 5th, increasing $0.35 or 1.44 percent since the previous trading session. Looking back, over the last four weeks, Amkor Technology gained 10.94 percent. Over the last 12 months, its price fell by 13.57 percent. Looking ahead, we forecast Amkor Technology to be priced at 24.44 by the end of this quarter and at 23.83 in one year, according to Trading Economics global macro models projections and analysts expectations.

Amkor Technology, Inc. is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.